Pherdinand
the snow must go on
Sensor dies are made the same way other semiconductors are made. This is the reason that a FF sensor is made in two pieces. The Mfg. standard won't allow for a die the size of a FF sensor. Fabs the world over have the same Specs for production of wafers. So, a curved sensor is not likely. Film can be curved..
It's possible that all this will change.. but not quickly. Bigger, maybe, but not curved. We can thank Dr. Lam (Lam Research) for this advancement.
http://moeadham.ca/intels-upcoming-450mm-capable-wafer-fab/
http://www.lamresearch.com/
at the moment the usual max die size in semiconductor chipmakery is 26x33mm (the 33 can be stretched a bit...in principle up to 42mm)
of course special cases do exist🙂
anyway. Curved sensor is not possible - on silicon.
But we're not restricted to silicon wafers anymore...